📅 7 November 2025
🕐 12:30–14:30
📍 Fraunhofer IZM, Berlin, Germany
🎟️ Workshop by EPoSS Working Group on Advanced Packaging – part of Electronic Packaging Days 2025. Register here!
The EPoSS Working Group on Advanced Packaging will host a dedicated workshop, “Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging”, during Fraunhofer IZM’s Electronic Packaging Days 2025 in Berlin.
The session brings together researchers, technology developers, and industry stakeholders to explore how European collaboration can accelerate the transition from laboratory innovation to full-scale manufacturing in advanced packaging. The workshop will focus on brokerage opportunities and shared initiatives that strengthen Europe’s semiconductor and system integration capabilities.
As part of the Electronic Packaging Days, the event offers a practical platform for networking, idea exchange, and partnership building within the European microelectronics community. Participants can expect discussions on ongoing Lab-to-Fab accelerator projects, funding opportunities, and the integration of packaging technologies into the broader European Chips Act strategy.
Hosted by Fraunhofer IZM in collaboration with EPoSS (European Association on Smart Systems Integration), the workshop highlights Europe’s commitment to advancing sustainable and innovative packaging solutions, bridging the gap between research excellence and industrial impact.