📅 6–7 November 2025
📍 Berlin, Germany – Fraunhofer IZM
🎟️ In person – Free registration here!
The Electronic Packaging Days 2025, hosted by Fraunhofer IZM in Berlin, is shaping up to be a key meeting point for industry and research in microelectronic packaging and heterogeneous system integration.
Over two days, participants will join lab tours across 12 of IZM’s facilities (including the clean room), take part in expert sessions, and gain insight into the APECS pilot line and recent innovations in advanced packaging.
The event, held in English, promotes collaboration, dialogue, and knowledge exchange between IZM researchers and industrial stakeholders.